Application Of Refractory Materials Such As Tungsten And Molybdenum in The Semiconductor Field

With the rapid development of science and technology, high-tech technologies such as smart homes, artificial intelligence, autonomous driving, 5G, and battery energy storage have entered the lives of ordinary people, thanks to the continuous innovation and development of the integrated circuit industry. Integrated circuit, also known as IC, refers to the production of specific functional circuits on a wafer through a special semiconductor process. It follows Moore's law and is iterated over time. Nowadays, an integrated chip the size of a nail nail often has billions of transistors. So how was such a large, complex, and delicate chip produced?
The preparation of chips mainly relies on micro processing, automation, and chemical synthesis technologies. The complete production process includes several steps, including chip design, wafer manufacturing, testing, and packaging, among which wafer manufacturing is a complex process to date. The wafer manufacturing process includes ion implantation, wafer testing, and subsequent chip testing
This process cannot be separated from refractory metal materials such as tungsten and molybdenum.
Hengbi Metal provides refractory metal products for the semiconductor field, including pure tungsten probes, tungsten rhenium probes, key components of tungsten molybdenum tantalum for ion implantation, and customized tungsten molybdenum components. Our tungsten molybdenum components have been widely used in semiconductor fields such as IC and wafer manufacturing.